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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11124602 B1

PDFFull Text
Date of Patent:
Sep. 21, 2021

Filed:

May. 31, 2011

Method for adhering resin molded articles

Applicant:

Kouichi Sakata, Shizuoka, JP;

Inventor:

Kouichi Sakata, Shizuoka, JP;

Assignee:

POLYPLASTICS CO., LTD., Tokyo, JP;

Attorney:

Knobbe, Martens, Olson & Bear LLP

Primary Examiner:

Vivian Chen

Int. Cl.
CPC ...
C08G 63/06 (2006.01); C08G 63/183 (2006.01); C08J 5/12 (2006.01); B32B 37/12 (2006.01); B32B 25/20 (2006.01); B32B 27/36 (2006.01); B32B 27/28 (2006.01); B32B 27/06 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 7/04 (2019.01); C08K 3/016 (2018.01); C08K 5/00 (2006.01); C08G 63/18 (2006.01); C08K 5/541 (2006.01); C08G 63/123 (2006.01); C08K 5/14 (2006.01); C08G 63/127 (2006.01); C08K 3/014 (2018.01); C08K 5/5415 (2006.01); C08G 63/02 (2006.01); C08K 5/5419 (2006.01); C08G 63/181 (2006.01); C08G 63/16 (2006.01); C08K 3/013 (2018.01); C08G 63/12 (2006.01); C09J 183/04 (2006.01); C09J 183/00 (2006.01); C08L 67/02 (2006.01); C08L 67/03 (2006.01);
U.S. Cl.
CPC ...
C08G 63/06 (2013.01); C08G 63/183 (2013.01); C08J 5/128 (2013.01); B32B 7/04 (2013.01); B32B 7/12 (2013.01); B32B 25/20 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/283 (2013.01); B32B 27/36 (2013.01); B32B 37/12 (2013.01); B32B 2037/1253 (2013.01); C08G 63/02 (2013.01); C08G 63/12 (2013.01); C08G 63/123 (2013.01); C08G 63/127 (2013.01); C08G 63/16 (2013.01); C08G 63/18 (2013.01); C08G 63/181 (2013.01); C08J 2367/02 (2013.01); C08J 2367/03 (2013.01); C08J 2483/04 (2013.01); C08K 3/013 (2018.01); C08K 3/014 (2018.01); C08K 3/016 (2018.01); C08K 5/005 (2013.01); C08K 5/0066 (2013.01); C08K 5/0083 (2013.01); C08K 5/14 (2013.01); C08K 5/541 (2013.01); C08K 5/5415 (2013.01); C08K 5/5419 (2013.01); C08L 67/02 (2013.01); C08L 67/03 (2013.01); C09J 183/00 (2013.01); C09J 183/04 (2013.01); Y10T 428/31663 (2015.04); Y10T 428/31786 (2015.04);
Abstract

To provide a technique of improving adhesion of a resin molded article including a polyalkylene terephthalate resin to a silicon adhesive. A polyalkylene terephthalate resin is used in which an aromatic dicarboxylic acid excluding terephthalic acid, and/or an ester compound thereof is subjected to copolymerization as a modified component, and the content of the modified component relative to the total dicarboxylic acid component is at least 13 mol % and no more than 35 mol %. It is preferable if the modified polyalkylene terephthalate resin is a modified polybutylene terephthalate resin, and the aromatic dicarboxylic acid and/or an ester compound thereof is isophthalic acid and/or an ester compound thereof.

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