The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Nov. 21, 2018
MS Autotech Co., Ltd., Gyeongju-si, KR;
Myungshin Industry Co., Ltd., Gyeongju-si, KR;
Hyun Woo Lee, Suwon-si, KR;
Dae Ho Yang, Suwon-si, KR;
Jang Soo Kim, Gwacheon-si, KR;
Tae Kyu Lee, Seoul, KR;
MS AUTOTECH CO., LTD., Gyeongju-si, KR;
MYUNGSHIN INDUSTRY CO., LTD., Gyeongju-si, KR;
Abstract
Provided is a hot stamping die apparatus including sub-assemblies constructed by making a plurality of plates erect and sequentially overlapping the plurality of plates in a face-to-face manner. A first cooling channel extending along overlapping surfaces is provided by forming grooves corresponding to each other on overlapping surfaces of adjacent plates, A second cooling channel passing through the corresponding sub-assembly in the length direction is provided in at least one of the sub-assemblies.