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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11123709 B1

PDFFull Text
Date of Patent:
Sep. 21, 2021

Filed:

Jan. 31, 2018

Molded article

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Asuka Sasakura, Ageo, JP;

Katsuhiko Hayashi, Ageo, JP;

Atsushi Kurosaki, Ageo, JP;

Masanori Sato, Ageo, JP;

Kazuya Kinoshita, Ageo, JP;

Takahito Asanuma, Ageo, JP;

Seiji Moriuchi, Ageo, JP;

Assignee:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Cam N Nguyen

Int. Cl.
CPC ...
B01J 20/06 (2006.01); B01J 20/28 (2006.01); B01J 20/30 (2006.01); B01J 20/32 (2006.01); C01F 17/00 (2020.01); C02F 1/42 (2006.01); G21F 9/12 (2006.01); C01F 17/235 (2020.01);
U.S. Cl.
CPC ...
B01J 20/3007 (2013.01); B01J 20/06 (2013.01); B01J 20/2803 (2013.01); B01J 20/28004 (2013.01); B01J 20/28016 (2013.01); B01J 20/28057 (2013.01); B01J 20/28085 (2013.01); B01J 20/3014 (2013.01); B01J 20/321 (2013.01); B01J 20/3212 (2013.01); C01F 17/235 (2020.01); C02F 1/42 (2013.01); G21F 9/12 (2013.01);
Abstract

To provide a molded article which can have excellent strength, can also have high durability during repeated use, and can maintain high adsorption performance even when the content of a binder resin is reduced. A molded article containing cerium oxide particles and a binder resin, wherein cerium oxide particles which has an average particle diameter of 1 to 15 μm and in each of which a crystallite size is 40 to 200 Å are used.

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Sasakura, Asuka. (2021). Molded article (U.S. Patent No. 11123709). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11123709

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