logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11122697 B1

PDFFull Text
Date of Patent:
Sep. 14, 2021

Filed:

Aug. 07, 2018

Method of fabricating an electronic medical device, including overmolding an assembly with thermoplastic material

Applicant:

Medtronic Minimed, Inc., Northridge, CA (US);

Inventors:

Claire F. Ferraro, Edina, MN (US);

Shelley L. Thurk, Rogers, MN (US);

Assignee:

MEDTRONIC MINIMED, INC., Northridge, CA (US);

Attorney:

Shumaker & Sieffert, P.A.

Primary Examiner:

Anh D Mai

Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 5/06 (2006.01); A61B 5/145 (2006.01); B29C 45/14 (2006.01); H05K 1/18 (2006.01); H01R 12/71 (2011.01); B29K 79/00 (2006.01); B29K 77/00 (2006.01); B29L 31/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0034 (2013.01); A61B 5/14532 (2013.01); B29C 45/14819 (2013.01); B29C 45/14836 (2013.01); H05K 5/0069 (2013.01); H05K 5/069 (2013.01); A61B 2562/12 (2013.01); A61B 2562/166 (2013.01); A61B 2562/227 (2013.01); A61B 2562/242 (2013.01); B29C 2045/14844 (2013.01); B29K 2077/00 (2013.01); B29K 2079/08 (2013.01); B29L 2031/3425 (2013.01); B29L 2031/753 (2013.01); H01R 12/71 (2013.01); H05K 1/181 (2013.01); H05K 2201/10037 (2013.01);
Abstract

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

Find Patent Forward Citations

Loading…