The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Aug. 14, 2017
Applicant:

Pi-crystal Incorporation, Osaka, JP;

Inventors:

Junichi Takeya, Osaka, JP;

Seiichiro Yamaguchi, Osaka, JP;

Masataka Itoh, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/12 (2006.01); H05K 1/14 (2006.01); H01L 23/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/361 (2013.01); H05K 1/115 (2013.01); H05K 1/116 (2013.01); H05K 1/118 (2013.01); H05K 1/144 (2013.01); H05K 3/125 (2013.01); H05K 3/363 (2013.01); H05K 3/403 (2013.01); H05K 3/4038 (2013.01); H05K 3/4623 (2013.01); H05K 3/4635 (2013.01); H05K 3/4691 (2013.01); H01L 24/81 (2013.01); H01L 24/91 (2013.01); H05K 1/0393 (2013.01); H05K 3/1275 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49126 (2015.01);
Abstract

Described are processes for developing laminated circuit boards, as well as the resulting circuit boards themselves. Accordingly, at least two circuit boards at least partially overlap each other, and at least one through-hole is formed in an overlapping region thereof. The through-hole is filled with an electrically-conductive material, forming a through-via that enables the circuit boards to be electrically connected. When a circuit on each circuit board is laid out so that a part thereof reaches a region in which the through-via is to be formed, then that part of the circuit can be electrically connected to the through-via. Thus, portions of the circuits on the circuit boards can be electrically connected to each other via common through-vias to realize an integrated device in which the circuits on the laminated circuit boards function.


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