The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Oct. 17, 2018
Applicant:
Mbda Uk Limited, Stevenage, GB;
Inventors:
Adam Armitage, Bristol, GB;
Thomas James Heaton, Bolton, GB;
Assignee:
MBDA UK LIMITED, Stevenage, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0011 (2013.01); H05K 1/0313 (2013.01); H05K 1/115 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/0137 (2013.01); H05K 2201/0753 (2013.01); H05K 2201/09581 (2013.01);
Abstract
A circuit assembly () is disclosed comprising a substrate () and conducting layers () on opposing sides of the substrate (), there being at least one via () through the substrate (), which via () forms a conductive path between the conducting layers, wherein the substrate () is a foam substrate, and wherein the via () is provided with a solid dielectric lining () plated with a conducting material ().