The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Apr. 25, 2018
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Hayato Takakura, Osaka, JP;

Yoshihiro Kawamura, Osaka, JP;

Shuichi Wakaki, Osaka, JP;

Shusaku Shibata, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/0393 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.


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