The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Nov. 06, 2014
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Jürgen Huber, Erlangen, DE;

Bernhard Klaussner, Nuremberg, DE;

Dieter Schirm, Breitengüssbach, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 3/493 (2006.01); H02K 3/30 (2006.01); H02K 15/00 (2006.01); H01B 3/40 (2006.01); B29C 35/08 (2006.01); B29K 63/00 (2006.01); B29K 105/16 (2006.01); B29K 505/12 (2006.01);
U.S. Cl.
CPC ...
H02K 3/493 (2013.01); H01B 3/40 (2013.01); H02K 3/30 (2013.01); H02K 15/0018 (2013.01); B29C 35/0805 (2013.01); B29C 2035/0827 (2013.01); B29K 2063/00 (2013.01); B29K 2105/16 (2013.01); B29K 2105/162 (2013.01); B29K 2505/12 (2013.01); B29K 2995/0008 (2013.01);
Abstract

The invention relates to a slot sealing compound () for an electrical machine that comprises at least one slot () with a slot opening () for receiving an electrical conductor arrangement (). Said slot sealing compound () contains a magnetic filler material, particularly a soft-magnetic filler material, and a reactive resin mixture that comprises at least one resin component. In the interests of improving storage stability for said slot sealing compound (), the components thereof are selected to be suitable for cationic polymerisation. A catalyst, provided to accelerate the cationic polymerisation of said reactive resin mixture, is also added to said slot sealing compound ().


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