The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Apr. 18, 2019
Applicant:

Kitagawa Industries Co., Ltd., Aichi, JP;

Inventor:

Tomohisa Kurita, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/48 (2006.01); H01R 13/24 (2006.01); H01R 4/02 (2006.01);
U.S. Cl.
CPC ...
H01R 13/2442 (2013.01); H01R 4/02 (2013.01);
Abstract

A contact includes a thin plate member having elasticity and conductivity, is disposed between a first member and a second member, and electrically connects the first member and the second member via the thin plate member, and the contact includes a base portion and a movable portion. The base portion has a bonding surface to be bonded to the first member by soldering. The movable portion includes: a contact portion that contacts with the second member; and a connecting portion that connects to the base portion, and is configured to be elastically deformable with respect to the base portion. The connecting portion is gradually separated from the first member. A predetermined range from a connecting position of the connecting portion with the base portion is lower in solder wettability than the bonding surface.


Find Patent Forward Citations

Loading…