The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Dec. 23, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jae Yeong Kim, Suwon-si, KR;

Sung Nam Cho, Suwon-si, KR;

Ju Hyoung Park, Suwon-si, KR;

Jeong Ki Ryoo, Suwon-si, KR;

Kyu Bum Han, Suwon-si, KR;

Sung Yong An, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/06 (2006.01); H01Q 19/10 (2006.01); H01Q 1/48 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/065 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01Q 19/10 (2013.01);
Abstract

A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.


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