The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Aug. 31, 2018
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Roshan Murthy, Raleigh, NC (US);

Kenneth M. Davis, Raleigh, NC (US);

Jae-Hyung Park, Cary, NC (US);

Xiameng Shi, Cary, NC (US);

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 33/64 (2010.01); H01L 21/66 (2006.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 27/02 (2006.01); G02B 5/02 (2006.01); G02B 27/09 (2006.01); H01L 23/00 (2006.01); H01L 33/10 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); G02B 5/0205 (2013.01); G02B 27/0955 (2013.01); H01L 22/32 (2013.01); H01L 24/04 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 27/0248 (2013.01); H01L 33/10 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 33/647 (2013.01);
Abstract

Solid-state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs that include individually controllable LED chips are disclosed. In some embodiments, an LED package includes electrical connections configured to reduce corrosion of metals within the package; or decrease the overall forward voltage of the LED package; or provide an electrical path for electrostatic discharge (ESD) chips. In some embodiments, an LED package includes an array of LED chips, each of which is individually controllable such that individual LED chips or subgroups of LED chips may be selectively activated or deactivated. A single wavelength conversion element may be provided over the array of LED chips, or separate wavelength conversion elements may be provided over one or more individual LED chips of the array. Representative LED packages may be beneficial for applications where a high luminous intensity with a controllable brightness or adaptable emission pattern is desired.


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