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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11121120 B1

PDFFull Text
Date of Patent:
Sep. 14, 2021

Filed:

Dec. 12, 2018

Method and system for electronic devices with polycrystalline substrate structure interposer

Applicant:

Qromis, Inc., Santa Clara, CA (US);

Inventors:

Vladimir Odnoblyudov, Danville, CA (US);

Cem Basceri, Los Gatos, CA (US);

Shari Farrens, Boise, ID (US);

Assignee:

QROMIS, INC., Santa Clara, CA (US);

Attorney:

Kilpatrick Townsend & Stockton LLP

Primary Examiner:

Jae Lee

Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/15 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/486 (2013.01); H01L 23/3735 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H01L 23/5384 (2013.01); H01L 25/50 (2013.01); H01L 23/15 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/81191 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/141 (2013.01); H01L 2924/143 (2013.01); H01L 2924/1434 (2013.01);
Abstract

An interposer includes a polycrystalline ceramic core disposed between a first surface and a second surface of the interposer, an adhesion layer encapsulating the polycrystalline ceramic core, a barrier layer encapsulating the adhesion layer, and one or more electrically conductive vias extending from the first surface to the second surface through the polycrystalline ceramic core, the adhesion layer, and the barrier layer.

Find Patent Forward Citations

Odnoblyudov, Vladimir. (2021). Method and system for electronic devices with polycrystalline substrate structure interposer (U.S. Patent No. 11121120). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11121120

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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