The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Mar. 07, 2018
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Lea Di Cioccio, Saint Ismier, FR;
Abstract
A method for self-assembling microelectronic components includes providing a self-aligning substrate having protrusions, each having a thickness greater than 1 μm and an upper face and flanks, the upper face and the flanks being hydrophobic. The method also includes providing dies, each die having a first face and a second hydrophilic face, and providing a self-assembling substrate. Finally, the method includes obtaining, by capillary effect, the self-alignment of each die through the first face thereof on a protrusion of the self-aligning substrate, then obtaining the assembly of the dies through the second hydrophilic face thereof on the self-assembling substrate by direct adhesion. Such a method has application in the industrial production of 3D integrated circuits.