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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11121114 B1

PDFFull Text
Date of Patent:
Sep. 14, 2021

Filed:

Jul. 30, 2018

Wire bonding tool including a wedge tool

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Takanori Sugiyama, Matsumoto, JP;

Yosuke Miyazawa, Okaya, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Devang R Patel

Int. Cl.
CPC ...
B23K 20/10 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); B23K 20/004 (2013.01); B23K 20/10 (2013.01); H01L 24/85 (2013.01); B23K 2101/40 (2018.08); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/45169 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/48824 (2013.01); H01L 2224/48839 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/48847 (2013.01); H01L 2224/78315 (2013.01); H01L 2224/78611 (2013.01); H01L 2224/78705 (2013.01); H01L 2224/85186 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A bonding tool includes a wedge tool that presses a bonding wire against a principal plane of a structure such as an electrode to which the bonding wire is to be bonded. A groove formed in an end portion of a wedge tool body of the wedge tool is inclined along a longitudinal direction of the bonding wire so that a heel side of the groove is closer to the principal plane of the structure than a toe side of the groove. As a result, the wedge tool is inclined at a tilt angle and the bonding wire fits the groove in the end portion of the wedge tool body along the longitudinal direction of the bonding wire. Thus, a corner portion of the wedge tool does not contact the electrode.

Find Patent Forward Citations

Sugiyama, Takanori. (2021). Wire bonding tool including a wedge tool (U.S. Patent No. 11121114). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11121114

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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