The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
May. 01, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Roberto Mrad, Rennes, FR;
Stefan Mollov, Rennes, FR;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/473 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 23/473 (2013.01); H05K 1/0272 (2013.01); H05K 1/185 (2013.01); H05K 7/20936 (2013.01); H05K 2201/064 (2013.01); H05K 2203/0723 (2013.01);
Abstract
The present invention concerns a power module composed of a first and second parts (), the first part being composed of conductor layers and insulation layers, characterized in that a first conductor layer is on bottom of the first part, the second part is composed of at least one second conductor layer, the first and/or the second conductor layers comprise cavities that form pipes () when the first and second conductor layers are in contact, and in that the first and the second conductor layers are bonded together by a metal plating () of the walls of the pipes.