The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Mar. 12, 2020
Applicant:
Infineon Technologies Americas Corp., El Segundo, CA (US);
Inventor:
Shunhe Xiong, Westford, MA (US);
Assignee:
INFINEON TECHNOLOGIES AMERICAS CORP., El Segundo, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/482 (2006.01); H01L 23/49 (2006.01); H01L 23/04 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); H01L 23/04 (2013.01); H01L 23/291 (2013.01); H01L 23/4824 (2013.01); H01L 23/562 (2013.01);
Abstract
A packaged power device includes a ceramic package body having a top drain pad having a first area, a top source pad having a second area smaller than the first area, and a top gate pad having a third area smaller than the second area; a power device having a bottom surface affixed to a top drain pad, a die source pad coupled to the top source pad, and a die gate pad coupled to the top gate pad; and a ceramic lid affixed to the ceramic package body to form the packaged power device.