The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

May. 02, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Sang-moo Park, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 24/95 (2013.01); H01L 33/0095 (2013.01); H01L 25/0753 (2013.01); H01L 2924/14 (2013.01);
Abstract

A process system includes a substrate, first wafers, second wafers, and a roller. The first wafers are arranged at predetermined intervals along a first column which is parallel to an edge of the substrate, wherein each of the first wafers includes first chips. The second wafers are arranged at the predetermined intervals and at an offset from the first wafers, along a second column which is parallel to the first column, wherein each of the second wafers includes second chips. The roller is configured to roll in a first direction to pick up the plurality of first chips, roll in a second direction opposite to the first direction while suspended from the first wafers, pick up the second chips included in the wafers by rolling in the first direction, and transport the first chips and the second chips to the substrate.


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