The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Jan. 15, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Gopalakrishnan Trichy Rengarajan, Lippstadt, DE;

Sebastian Michalski, Lippstadt, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/54 (2006.01); H01L 25/07 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/54 (2013.01); H01L 23/24 (2013.01); H01L 23/295 (2013.01); H01L 23/3135 (2013.01); H01L 25/072 (2013.01); H01L 23/49811 (2013.01);
Abstract

A method for producing a power semiconductor module arrangement includes forming a pre-layer by depositing inorganic filler on a first surface within a housing, the inorganic filler being impermeable to corrosive gases. The method further includes filling casting material into the housing to fill spaces present in the inorganic filler of the pre-layer with the casting material, and hardening the casting material to form a first layer.


Find Patent Forward Citations

Trichy Rengarajan, Gopalakrishnan. (2021). Semiconductor module and method for producing the same (U.S. Patent No. 11121004). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11121004

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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