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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11120943 B1

PDFFull Text
Date of Patent:
Sep. 14, 2021

Filed:

Apr. 20, 2016

Method for manufacturing ceramic electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Yosuke Terashita, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett. LLP

Primary Examiner:

Thiem D Phan

Int. Cl.
CPC ...
H01G 7/00 (2006.01); H01G 4/248 (2006.01); H01C 7/00 (2006.01); H01G 4/12 (2006.01); C25D 3/12 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01L 41/047 (2006.01); H01L 41/293 (2013.01); C25D 5/12 (2006.01); C25D 5/56 (2006.01); H01C 17/28 (2006.01); H01F 41/02 (2006.01); H01G 4/252 (2006.01); H01L 41/29 (2013.01);
U.S. Cl.
CPC ...
H01G 4/248 (2013.01); C25D 3/12 (2013.01); C25D 5/12 (2013.01); C25D 5/56 (2013.01); H01C 7/008 (2013.01); H01C 17/28 (2013.01); H01F 17/0013 (2013.01); H01F 27/29 (2013.01); H01F 41/02 (2013.01); H01G 4/1209 (2013.01); H01G 4/252 (2013.01); H01L 41/0472 (2013.01); H01L 41/0477 (2013.01); H01L 41/29 (2013.01); H01L 41/293 (2013.01); Y10T 29/43 (2015.01);
Abstract

A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

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