The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Jun. 27, 2018
Applicant:

Soochow University, Suzhou, CN;

Inventors:

Tao Liu, Tallahassee, FL (US);

Xiaoshuang Duan, Suzhou, CN;

Jiangjiang Luo, Suzhou, CN;

Yanbo Yao, Suzhou, CN;

Assignee:

SOOCHOW UNIVERSITY, Suzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 17/28 (2006.01); G01D 5/16 (2006.01);
U.S. Cl.
CPC ...
H01C 17/28 (2013.01); G01D 5/16 (2013.01);
Abstract

The present invention discloses a method for manufacturing a high-sensitivity piezoresistive sensor using a multi-level structure design, including the following steps: forming first-level basic geometrical units formed of basic structural units on a substrate, where each first-level basic geometrical unit is a two-dimensional or three-dimensional network structure formed by stacking several basic structural units; stacking and combining several first-level basic geometrical units in an array to form a second-level geometrical structure, and forming a contact connection area located between adjacent first-level basic geometrical units; and dispensing a conductive adhesive in at least two positions on the substrate to form electrodes of a piezoresistive sensor, so as to obtain the piezoresistive sensor. A high-sensitivity piezoresistive sensor obtained by using the method of the present invention has flexible design and simple fabrication, can be desirably combined with various existing sensor fabrication methods, and has general applicability.


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