The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Apr. 25, 2017
Realtek Semiconductor Corp., Hsinchu, TW;
Chi-Kung Kuan, Taoyuan County, TW;
Chia-Liang (Leon) Lin, Fremont, CA (US);
REALTEK SEMICONDUCTOR CORP., Hsinchu, TW;
Abstract
An apparatus includes: a semiconductor die including a first I/O (input/output) pad, a second I/O pad, a switch, and an internal processor, wherein the switch is configured to short the first I/O pad to the second I/O pad when a control signal is asserted; and a semiconductor package including a first bond pad configured to electrically connect to the first I/O pad, a second bond pad configured to electrically connect to the second I/O pad, a first port configured to electrically connect to a high-speed pin of a multi-mode connector, a second port configured to electrically connect to an external processor, a first routing path configured to electrically connect the first port to the first bond pad, and a second routing path configured to electrically connect the second port to the second bond pad.