The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Oct. 23, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Helia Rahmani, Mountain View, CA (US);

Prithu Sharma, Cupertino, CA (US);

David Sheldon Schultz, Berkeley, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0446 (2019.05); H05K 1/0277 (2013.01); H05K 1/092 (2013.01); H05K 1/111 (2013.01); H05K 1/14 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04108 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/10121 (2013.01);
Abstract

Trace transfer techniques can be used to couple touch electrodes to touch sensing circuitry with a reduced border region around a touch sensor panel. Touch electrodes on a first side of the substrate can be routed to a bond pad region on the second side of the substrate via a trace transfer technique to enable single-sided bonding of a double-sided touch sensor panel. Trace transfer techniques can also be used to couple conductive traces on a first side of the substrate to a flex circuit oriented perpendicular to or otherwise not parallel to the first side of the substrate. Orienting the flex circuit in this way can allow the flex circuit to connect to touch circuitry with reduced bending as compared with the amount of bending of the flex circuit when oriented substantially parallel to the substrate.


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