The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Jun. 09, 2017
Applicant:

Aito Bv, Amsterdam, NL;

Inventors:

Pauli Laitinen, Helsinki, FI;

Jockum Lönnberg, Amsterdam, NL;

Ferdinand Van Der Neut, Amsterdam, NL;

Jari Heikki Antero Toropainen, Espoo, FI;

Assignee:

Aito BV, Amsterdam, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06F 3/01 (2006.01); H01L 41/08 (2006.01); B06B 1/06 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0414 (2013.01); B06B 1/0666 (2013.01); G06F 3/016 (2013.01); H01L 41/0475 (2013.01); H01L 41/053 (2013.01); H01L 41/0825 (2013.01); G06F 2203/04103 (2013.01);
Abstract

A piezoelectric touch device is provided. According to a first aspect, a piezoelectric touch device comprises: a conductive support structure comprising an inseparable section as a bridge separated by a first opening; a piezoelectric element configured to provide a touch sensing and a haptic feedback; connection pads configured to form an electrically connected circuit for the piezoelectric element, wherein the piezoelectric element is electrically connected to the connection pads, and wherein the bridge comprises one of the connection pads and the conductive support structure comprises another of the connection pads; a second opening next to the another connection pad allowing the piezoelectric element to bend freely. The piezoelectric touch device for touch sensing and haptic feedback may be consequently manufactured with an improved manufacturability.


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