The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Dec. 25, 2018
Applicant:
Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Wuhan, CN;
Inventor:
Kaixiang Zhao, Wuhan, CN;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0007 (2013.01);
Abstract
A method of cutting a flexible substrate includes providing a flexible substrate pre-configured with a cutting area, providing an obstruction covering a non-cutting area of the flexible substrate to expose the cutting area of the flexible substrate, and performing a dry etching to the flexible substrate to decompose the cutting area of the flexible substrate, such that internal components of the flexible substrate can be protected during a flexible substrate cutting process.
Zhao, Kaixiang. (2021). Method of cutting a flexible substrate (U.S. Patent No. 11119407). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11119407
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