The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Jul. 06, 2015
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Norifumi Kameshiro, Tokyo, JP;

Akio Shima, Tokyo, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01T 1/24 (2006.01); H01L 31/0312 (2006.01); H01L 31/117 (2006.01); H01L 31/02 (2006.01); H01L 31/0224 (2006.01); H01L 31/115 (2006.01);
U.S. Cl.
CPC ...
G01T 1/241 (2013.01); G01T 1/24 (2013.01); H01L 31/02019 (2013.01); H01L 31/022408 (2013.01); H01L 31/0312 (2013.01); H01L 31/115 (2013.01); H01L 31/117 (2013.01);
Abstract

There is provided a radiation detector using SiC and of a structure in which an electric field is applied to the interior of the entire SiC crystal constituting a radiation sensible layer, aiming to detect radiation while suppressing a reduction in electric signals generated in the radiation sensible layer. The radiation detector includes: a radiation sensible layer formed of silicon carbide and configured to generate an electron hole pair due to radiation entering it; a first semiconductor region in contact with a first principal surface of the radiation sensible layer and exhibiting a first impurity concentration at least in the region in contact with the radiation sensible layer; a second semiconductor region in contact with a second principal surface on the opposite side of the first principal surface and exhibiting a second impurity concentration at least in the region in contact with the radiation sensible layer; a first electrode connected to the first semiconductor region; and a second electrode connected to the second semiconductor region. The impurity concentration in the radiation sensible layer adjacent to the first semiconductor region, with the first principal surface serving as a border, is discontinuous with the first impurity concentration; the impurity concentration in the radiation sensible layer adjacent to the second semiconductor region, with the second principal surface serving as a border, is discontinuous with the second impurity concentration; and an electric field is applied to the entire radiation sensible layer in the depth direction thereof at a voltage during operation.


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