The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Jun. 19, 2017
Applicant:

Ckd Corporation, Komaki, JP;

Inventors:

Tatsushi Nabei, Kasugai, JP;

Michio Miyashita, Seto, JP;

Shinji Ishikawa, Kasugai, JP;

Fumihito Tsuchiya, Komaki, JP;

Assignee:

CKD CORPORATION, Komaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16K 1/36 (2006.01); F16K 31/122 (2006.01); F16K 41/12 (2006.01);
U.S. Cl.
CPC ...
F16K 1/36 (2013.01); F16K 31/122 (2013.01); F16K 31/1221 (2013.01); F16K 41/12 (2013.01);
Abstract

A fluid control valve and manufacturing method thereof, wherein, when a pressing force acts on the engagement surface between a diaphragm member and a valve seat-contacting member, the valve seat-contacting member is not displaced and no gap is formed. The diaphragm member made of a first fluorine-based resin material is provided with a diaphragm membrane and a rod-shaped part in the center of the diaphragm membrane. The valve seat-contacting member made of an injection-moldable second fluorine-based resin material is provided with a ring-shaped sealing surface and a recess on the opposite side from the ring-shaped sealing surface. The rod-shaped part is partly fitted into the recess. A ring-shaped recessed is formed on outer circumference of a portion of the rod-shaped part. A small diameter recess is formed on the inner circumference of the recess. The ring-shaped recess section and the small diameter recess adhere closely to form the engagement surface.


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