The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Nov. 30, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Wusheng Xu, Haikou, CN;

Laura Cerully Dial, Niskayuna, NY (US);

Lawrence Bernard Kool, Niskayuna, NY (US);

Dalong Zhong, Niskayuna, NY (US);

Hong Zhou, Shanghai, CN;

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3213 (2006.01); H01L 21/3205 (2006.01); H01L 21/02 (2006.01); C23F 1/20 (2006.01); C23F 1/16 (2006.01); C23F 1/14 (2006.01); C23F 1/10 (2006.01); C23F 1/00 (2006.01); C23C 26/00 (2006.01); C23C 10/60 (2006.01); C23C 10/48 (2006.01); B33Y 40/00 (2020.01);
U.S. Cl.
CPC ...
C23C 26/00 (2013.01); B33Y 40/00 (2014.12); C23C 10/48 (2013.01); C23C 10/60 (2013.01); C23F 1/00 (2013.01); C23F 1/10 (2013.01); C23F 1/14 (2013.01); C23F 1/16 (2013.01); C23F 1/20 (2013.01); H01L 21/02148 (2013.01); H01L 21/02178 (2013.01); H01L 21/32056 (2013.01); H01L 21/32133 (2013.01); H01L 21/32134 (2013.01);
Abstract

A surface of an article is modified by aluminizing an initial surface at a first temperature to form a first aluminized layer and a sublayer, removing at least a portion of the first aluminized layer, aluminizing the sublayer at a second temperature to form a second aluminized layer, and finally removing at least a portion of the second aluminized layer to form a processed surface. The second temperature is less than the first temperature and a roughness of the processed surface is less than the roughness of the initial surface.


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