The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Jun. 06, 2018
Applicant:
Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;
Inventors:
Shintaro Abe, Kanagawa, JP;
Kanako Furutachi, Kanagawa, JP;
Takeshi Kondo, Kanagawa, JP;
Rikia Furusho, Kanagawa, JP;
Assignee:
TANAKA KIKINZOKU KOGYO K.K., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 163/00 (2006.01); C09K 5/14 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 163/00 (2013.01); C09K 5/14 (2013.01); H01B 1/22 (2013.01);
Abstract
The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.