The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Aug. 29, 2017
Applicant:

Kabushiki Kaisha Toyota Jidoshokki, Kariya, JP;

Inventors:

Yusuke Sugiyama, Kariya, JP;

Takeshi Kondo, Kariya, JP;

Takahiro Sugioka, Kariya, JP;

Kohei Mase, Kariya, JP;

Keigo Oyaizu, Kariya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/14 (2006.01); C08F 212/08 (2006.01); C08K 5/18 (2006.01); H01G 11/38 (2013.01); H01M 4/133 (2010.01); H01M 4/134 (2010.01); H01M 4/62 (2006.01); H01M 10/0525 (2010.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
C08G 73/14 (2013.01); C08F 212/08 (2013.01); C08K 5/18 (2013.01); H01G 11/38 (2013.01); H01M 4/133 (2013.01); H01M 4/134 (2013.01); H01M 4/622 (2013.01); H01M 10/0525 (2013.01); H01M 2004/027 (2013.01);
Abstract

A polymer compound includes a first chain structure constituted by a polyamideimide and a second chain structure constituted by a vinyl polymer and bonded to terminals of the first chain structures and connecting the first chain structures together. The vinyl polymer constituting the second chain structure is a random copolymer including a bond-constituting unit having a side chain to be bonded to the first chain structure, and a non-bond-constituting unit having no side chain to be bonded to the first chain structure.


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