The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2021

Filed:

Oct. 17, 2018
Applicant:

Formlabs, Inc., Somerville, MA (US);

Inventors:

Eduardo Torrealba, Cambridge, MA (US);

Steven Thomas, Cambridge, MA (US);

Christopher Auld, Boston, MA (US);

Assignee:

Formlabs, Inc., Somerville, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/295 (2017.01); B29C 64/153 (2017.01); B29C 64/218 (2017.01); B29C 35/02 (2006.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B29C 64/393 (2017.01); B29C 64/205 (2017.01); B22F 10/20 (2021.01); B22F 10/30 (2021.01);
U.S. Cl.
CPC ...
B29C 64/295 (2017.08); B22F 10/20 (2021.01); B29C 35/02 (2013.01); B29C 64/153 (2017.08); B29C 64/205 (2017.08); B29C 64/218 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B22F 10/30 (2021.01); B29C 2035/0283 (2013.01);
Abstract

Techniques for improved efficiency of sintering in additive fabrication are described. According to some aspects, mechanisms for depositing and leveling source material are combined with a mechanism for heating the material. In some embodiments, one or more heating elements may be arranged to lead and/or follow a material deposition mechanism such that heat may be applied to the build region in concert with deposition of material. As a result of this technique, the heating and depositing steps may be performed closer together in time and/or heat may be applied more directly to the material than in conventional systems. As a result, greater control over material temperature may be achieved, thereby avoiding excess temperature exposure and subsequent undesirable changes to the material.


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