The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2021
Filed:
Jan. 14, 2015
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Hou T. Ng, Campbell, CA (US);
Alejandro Manuel De Pena, Sant Cugat del Valles, ES;
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/291 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B29C 64/165 (2017.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01); B29C 64/153 (2017.01); B29C 64/188 (2017.01); B29C 64/393 (2017.01);
U.S. Cl.
CPC ...
B29C 64/291 (2017.08); B29C 64/153 (2017.08); B29C 64/165 (2017.08); B29C 64/188 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12);
Abstract
In one example, a non-transitory processor readable medium with instructions thereon that when executed cause an additive manufacturing machine to inhibit build material in an overlying layer of build material from fusing with a first slice formed in an underlying layer of build material.