The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Aug. 01, 2019
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Qigui Wang, Rochester Hills, MI (US);

Song He, Troy, MI (US);

Seongchan Pack, West Bloomfield, MI (US);

Angela P. Willis, Ortonville, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/03 (2006.01); G10K 11/168 (2006.01); B60R 16/02 (2006.01); B32B 5/18 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 5/03 (2013.01); B32B 5/18 (2013.01); B32B 15/046 (2013.01); B32B 15/20 (2013.01); B60R 16/02 (2013.01); G10K 11/168 (2013.01); B32B 2266/045 (2013.01); B32B 2307/102 (2013.01); B32B 2605/00 (2013.01); H05K 7/20872 (2013.01); H05K 7/20927 (2013.01);
Abstract

A damping cover for an integrated power electronics module (IPEM), the damping cover generally defined by a top side and a bottom side, wherein the bottom side is configured to mate adjacent with or contiguous to a power inverter module (PIM) of the IPEM. The damping cover can include an aluminum foam core including a top surface generally corresponding to the top side of the damping cover and a bottom surface generally corresponding to the bottom side of the damping cover and a polymeric over-molding or non-porous aluminum outer layer covering the top surface and/or a polymeric over-molding or non-porous aluminum outer layer covering the bottom surface. The bottom side of the damping cover can mate adjacent with or contiguous to the PIM. The polymeric material over-molding can completely impregnate the aluminum foam core. The aluminum foam core can have a density of about 0.15 g/cmto about 1.0 g/cm.


Find Patent Forward Citations

Loading…