The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Dec. 05, 2017
Applicant:

Conti Temic Microelectronic Gmbh, Nuremberg, DE;

Inventors:

Konrad Rothenhaeusler, Achberg, DE;

Franz Pfeiffer, Einsingen, DE;

Thilo Berg, Neu Ulm, DE;

Jos Becher, Beimerstetten, DE;

Andreas Schleinkofer, Regensburg, DE;

Martin Vallendor, Ravensburg, DE;

Matthias Dropmann, Friedrichshafen, DE;

Oscar Torres Alsina, Ingolstadt, DE;

Steffen Goermer, Winterrieden, DE;

Patrick Albrecht, Ingolstadt, DE;

Hendrik Powileit, Bodolz, DE;

Dieter Kroekel, Eriskirch, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); H05K 1/0393 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/2009 (2013.01);
Abstract

A flexible conductor track () for connecting electronic modules, includes conductor track structures (), two connecting regions () for electrically connecting the conductor track structures () to corresponding conductor tracks of electronic modules, and at least one long slit () in a region () in the conductor track () located between the two connecting regions. At least one of the connecting regions is designed to be connected to a corresponding connecting region of an electronic module by anisotropic conductive film adhesive (ACFA) bonding.


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