The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Nov. 09, 2018
Applicant:

National Taiwan University of Science and Technology, Taipei, TW;

Inventors:

Jinn P. Chu, Taipei, TW;

Chia-Chi Yu, Taipei, TW;

Bo-Zhang Lai, Taipei, TW;

Chun-Tao Chen, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); H04R 7/12 (2006.01);
U.S. Cl.
CPC ...
H04R 31/003 (2013.01); H04R 7/127 (2013.01); H04R 2307/023 (2013.01); H04R 2307/025 (2013.01); H04R 2307/027 (2013.01);
Abstract

A diaphragm structure is used for an audio signal output device. The diaphragm structure includes a film substrate, a polymer fiber structure and a thin film metallic glass. The film substrate includes a first surface and a second surface opposite to the first surface. The polymer fiber structure is combined with the first surface of the film substrate. The thin film metallic glass is formed on at least a part of the second surface of the film substrate.


Find Patent Forward Citations

Chu, Jinn. (2021). Diaphragm structure and method of manufacturing the same (U.S. Patent No. 11115767). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11115767

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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