The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Jul. 11, 2019
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Daiki Yanagishima, Kyoto, JP;

Toshiyuki Ishikawa, Kyoto, JP;

Hirotaka Takihara, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/691 (2006.01); H03K 17/61 (2006.01); H04L 25/02 (2006.01); G01R 31/27 (2006.01); G01R 31/28 (2006.01); H02P 31/00 (2006.01);
U.S. Cl.
CPC ...
H03K 17/691 (2013.01); G01R 31/27 (2013.01); G01R 31/2884 (2013.01); H02P 31/00 (2013.01); H03K 17/61 (2013.01); H04L 25/028 (2013.01);
Abstract

A signal transmission device includes a first lead frame supporting a signal transmission chip that includes first and second inductor spiral rings, a first bonding pad electrically coupled between the first and second inductor spiral rings, and a guard ring provided to roundly cover the first and second inductor spiral rings in a plan view. Bonding pads are provided outside of the guard ring. A direction of rotation between the first and second inductor spiral rings are different from each other so that the first and second inductor spiral rings are disposed substantially symmetrically about the first bonding pad. A second lead frame supports a semiconductor chip, with the signal transmission chip and the semiconductor chip facing each other.


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