IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11114836 B1

PDFFull Text
Date of Patent:
Sep. 07, 2021

Filed:

Apr. 08, 2016

Semiconductor device, intelligent power module and power conversion apparatus

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Rei Yoneyama, Tokyo, JP;

Fumitaka Tametani, Tokyo, JP;

Manabu Matsumoto, Tokyo, JP;

Haruhiko Takemoto, Tokyo, JP;

Hiroshi Yoshida, Tokyo, JP;

Motonobu Joko, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Jared Fureman

Assistant Examiner:

Lucy M Thomas

Int. Cl.
CPC ...
H02H 3/00 (2006.01); H02H 3/08 (2006.01); H02H 5/04 (2006.01); H02M 7/00 (2006.01); H02H 7/10 (2006.01); H02H 7/22 (2006.01); H01L 23/049 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 27/02 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01); H02H 3/20 (2006.01); H02M 1/32 (2007.01); H02M 7/5387 (2007.01); H02M 1/08 (2006.01);
U.S. Cl.
CPC ...
H02H 3/08 (2013.01); H01L 23/049 (2013.01); H01L 23/3114 (2013.01); H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 27/0248 (2013.01); H01L 29/1602 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/7393 (2013.01); H01L 29/861 (2013.01); H02H 3/085 (2013.01); H02H 3/20 (2013.01); H02H 5/04 (2013.01); H02H 5/041 (2013.01); H02H 7/10 (2013.01); H02H 7/222 (2013.01); H02M 7/003 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); H02M 1/08 (2013.01); H02M 1/32 (2013.01); H02M 1/327 (2021.05); H02M 7/5387 (2013.01);
Abstract

The present invention relates to a semiconductor device and it is an object of the present invention to provide a semiconductor device that makes it easy to change a specification on driving of a power semiconductor element or control of a protection operation thereof. The semiconductor device includes a power semiconductor element, a main electrode terminal of the power semiconductor element, a sensor section that emits a signal corresponding to a physical state of the power semiconductor element, a sensor signal terminal connected to the sensor section, a drive terminal that supplies power to drive the power semiconductor element and a case that accommodates the power semiconductor element, the main electrode terminal, the sensor section, the sensor signal terminal and the drive terminal, and the sensor signal terminal and the drive terminal are provided so as to be connectable from outside the case.

Find Patent Forward Citations

Loading…