The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Oct. 05, 2017
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Shigeru Tanaka, Shizuoka, JP;

Masayuki Kataoka, Shizuoka, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02G 1/14 (2006.01); H01R 43/02 (2006.01); H01R 4/02 (2006.01); H01B 7/02 (2006.01); H01R 4/10 (2006.01); H01R 4/70 (2006.01);
U.S. Cl.
CPC ...
H02G 1/145 (2013.01); H01B 7/02 (2013.01); H01R 4/021 (2013.01); H01R 4/029 (2013.01); H01R 43/0214 (2013.01); H01R 4/10 (2013.01); H01R 4/70 (2013.01);
Abstract

In a joining method of an electric wire, an end of a first conductor is held by a holding surface of a first jig electrode from an outer circumference side and an end of a second conductor is held by a holding surface of a second jig electrode from an outer circumference side to butt and join the ends of the first conductor and the second conductor in the axial direction while heating the ends. Then, a melted material is bulged outward from an outer circumferential surface of a joining portion to a bulge molding portion formed to surround a joining portion of the ends of the first conductor and the second conductor.


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