The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Mar. 22, 2018
3m Innovative Properties Company, St. Paul, MN (US);
Ankit Mahajan, St. Paul, MN (US);
Mikhail L. Pekurovsky, Bloomington, MN (US);
Matthew S. Stay, Minneapolis, MN (US);
Shawn C. Dodds, St. Paul, MN (US);
Thomas J. Metzler, St. Paul, MN (US);
Matthew R. D. Smith, Woodbury, MN (US);
Saagar A. Shah, Woodbury, MN (US);
Jae Yong Lee, Santa Clara, CA (US);
James F. Poch, New Richmond, WI (US);
Roger W. Barton, Afton, MN (US);
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.