The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
May. 24, 2019
Applicant:
Nanya Technology Corporation, New Taipei, TW;
Inventor:
Hung-Chi Tsai, New Taipei, TW;
Assignee:
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10888 (2013.01); H01L 27/10805 (2013.01); H01L 27/10885 (2013.01); H01L 27/10891 (2013.01);
Abstract
A semiconductor device includes a semiconductor substrate, a first word line and a second word line disposed over the semiconductor substrate, and a conductive plug disposed between the first word line and the second word line. The semiconductor device also includes a conductive cap layer disposed over the conductive plug, wherein a top surface and a portion of a sidewall surface of the conductive plug are covered by the conductive cap layer. The semiconductor device further includes a bit line disposed over the conductive cap layer, wherein the bit line is electrically connected to the conductive plug.