The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Oct. 25, 2017
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Thomas Schwarz, Regensburg, DE;

Jürgen Moosburger, Lappersdorf, DE;

Frank Singer, Regenstauf, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 21/67 (2006.01); B65G 47/90 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); B65G 47/90 (2013.01); H01L 21/67144 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 33/0095 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75303 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/95136 (2013.01); H01L 2224/95146 (2013.01); H01L 2224/97 (2013.01);
Abstract

A method of transferring semiconductor chips includes providing a transfer tool having a plurality of segments, each segment having a liquid receiving area; providing a plurality of semiconductor chips in a regular array on a source carrier; providing a target carrier; selectively arranging liquid drops on the liquid receiving areas of some of the segments; causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip; lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool; causing the target carrier by the transfer tool, to approach the semiconductor chips arranged on the transfer tool contacting the target carrier; and lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier


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