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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11114365 B1

PDFFull Text
Date of Patent:
Sep. 07, 2021

Filed:

Dec. 21, 2017

Electronic element mounting substrate, electronic device, and electronic module

Applicant:

Kyocera Corporation, Kyoto, JP;

Inventor:

Noboru Kitazumi, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:

Volpe Koenig

Primary Examiner:

David Vu

Assistant Examiner:

Brandon C Fox

Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/36 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 31/024 (2014.01); H01S 5/02 (2006.01); H01S 5/024 (2006.01); H05K 1/02 (2006.01); H01L 23/12 (2006.01); H01S 5/022 (2021.01); H01L 33/48 (2010.01); H01S 5/0237 (2021.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/12 (2013.01); H01L 23/15 (2013.01); H01L 23/36 (2013.01); H01L 23/49833 (2013.01); H01L 31/024 (2013.01); H01L 33/48 (2013.01); H01S 5/022 (2013.01); H01S 5/0206 (2013.01); H01S 5/02469 (2013.01); H05K 1/02 (2013.01); H01S 5/0237 (2021.01);
Abstract

An electronic element mounting substrate includes a first substrate including a first main surface and a mounting portion in a rectangular shape for mounting an electronic element, positioned on the first main surface and one end portion of the mounting portion in a longitudinal direction being positioned at an outer edge portion of the first main surface and a second substrate positioned on a second main surface opposite to the first main surface, formed of a carbon material, and including a third main surface facing the second main surface and a fourth main surface opposite to the third main surface. A thermal conduction of the mounting portion in a direction perpendicular to in a longitudinal direction is greater than a thermal conduction of the mounting portion in the longitudinal direction, in the third main surface or the fourth main surface, in plan view.

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