The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2021
Filed:
Jan. 30, 2020
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Suk Youn Hong, Suwon-si, KR;
Han Su Park, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a substrate, a plurality of electronic components mounted on a first surface of the substrate, and an encapsulant disposed on the first surface of the substrate so that at least one of the plurality of electronic components is embedded in the encapsulant. The substrate includes a flow preventing portion including at least one flow preventing groove disposed in the first surface and adjacent to the encapsulant and/or at least one dam disposed on the first surface and adjacent to the encapsulant.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile