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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11114355 B1

PDFFull Text
Date of Patent:
Sep. 07, 2021

Filed:

Aug. 15, 2019

Power module and method for manufacturing power module

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Takahiro Hayakawa, Nagaokakyo, JP;

Yasutaka Sugimoto, Nagaokakyo, JP;

Tomoki Kato, Nagaokakyo, JP;

Yoichi Moriya, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Xiaoming Liu

Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/13 (2006.01); H01L 23/373 (2006.01); C04B 41/50 (2006.01); C04B 41/87 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); F28F 21/04 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); C04B 41/5059 (2013.01); C04B 41/5066 (2013.01); C04B 41/87 (2013.01); F28F 21/04 (2013.01); H01L 21/4882 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 24/32 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 1/0201 (2013.01); H05K 1/0306 (2013.01); H05K 3/4629 (2013.01); H01L 2224/32237 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1426 (2013.01);
Abstract

A power module includes a power wiring line provided with a power element, a glass ceramic multilayer substrate provided with a control element to control the power element, and a highly heat-conductive ceramic substrate made of a ceramic material having higher thermal conductivity than a glass ceramic contained in the glass ceramic multilayer substrate. The power wiring line is disposed on the highly heat-conductive ceramic substrate, and the glass ceramic multilayer substrate is disposed directly on the highly heat-conductive ceramic substrate.

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