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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11114349 B1

PDFFull Text
Expired
Date of Patent:
Sep. 07, 2021

Filed:

Oct. 31, 2018

System and method for allowing restoration of first interconnection of die of power module

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Jeffrey Ewanchuk, Rennes, FR;

Julio Brandelero, Rennes, FR;

Stefan Mollov, Rennes, FR;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Luan C Thai

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/22 (2013.01); H01L 23/3735 (2013.01); H01L 24/20 (2013.01); H01L 24/45 (2013.01); H01L 2224/215 (2013.01); H01L 2224/45124 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/3512 (2013.01);
Abstract

The present invention concerns a system for allowing the restoration of a first interconnection of a die of a power module connecting the die to an electric circuit. The system comprises: at least one other interconnection of the power module, a periodic current source that is connected to the at least one other interconnection for generating a periodic current flow through the at least one other interconnection in order to reach, in at least a part of the first interconnection, a predetermined temperature during a predetermined time duration. The present invention concerns also the associated method.

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Ewanchuk, Jeffrey. (2021). System and method for allowing restoration of first interconnection of die of power module (U.S. Patent No. 11114349). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11114349

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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