The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Aug. 20, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Wendell Glenn Boyd, Jr., Morgan Hill, CA (US);

Jim Zhongyi He, San Jose, CA (US);

Zhenwen Ding, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); H01L 21/66 (2006.01); C23C 14/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01J 37/32 (2013.01); H01J 37/32724 (2013.01); H01J 37/32935 (2013.01); H01L 21/67017 (2013.01); H01L 21/67109 (2013.01); H01L 21/67253 (2013.01); H01L 21/67288 (2013.01); H01L 22/26 (2013.01); C23C 14/50 (2013.01); H01J 2237/24507 (2013.01); H01L 22/12 (2013.01);
Abstract

Embodiments described herein provide methods and apparatus used to reduce or substantially eliminate undesirable scratches to the non-active surface of a substrate by monitoring and controlling the deflection of a substrate, and thus the contact force between the substrate and a substrate support, during substrate processing. In one embodiment a method for processing a substrate includes positioning the substrate on a patterned surface of a substrate support, where the substrate support is disposed in a processing volume of a processing chamber, applying a chucking voltage to a chucking electrode disposed in the substrate support; flowing a gas into a backside volume disposed between the substrate and the substrate support, monitoring a deflection of the substrate, and changing a chucking parameter based on the deflection of the substrate.


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