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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11114322 B1

PDFFull Text
Date of Patent:
Sep. 07, 2021

Filed:

Mar. 10, 2017

Mold and transfer molding apparatus

Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Takeori Maeda, Mie, JP;

Ryoji Matsushima, Yokkaichi, JP;

Makoto Kawaguchi, Chikuma, JP;

Masaaki Wakui, Chikuma, JP;

Assignee:

Toshiba Memory Corporation, Minato-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Francisco W Tschen

Assistant Examiner:

Guy F Mongelli

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B29C 45/03 (2006.01); B29C 45/02 (2006.01); B29C 45/14 (2006.01); B29C 45/77 (2006.01); B29C 45/78 (2006.01); B29C 45/80 (2006.01); B29C 45/34 (2006.01); H01L 21/687 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); B29C 45/02 (2013.01); B29C 45/03 (2013.01); B29C 45/14065 (2013.01); B29C 45/14336 (2013.01); B29C 45/34 (2013.01); B29C 45/77 (2013.01); B29C 45/78 (2013.01); B29C 45/80 (2013.01); H01L 21/67248 (2013.01); H01L 21/68721 (2013.01); B29C 2045/14155 (2013.01); B29C 2945/7604 (2013.01); B29C 2945/76006 (2013.01); B29C 2945/7618 (2013.01); B29C 2945/76083 (2013.01); B29C 2945/76254 (2013.01); B29C 2945/76287 (2013.01); B29C 2945/76568 (2013.01); B29L 2031/34 (2013.01);
Abstract

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

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