The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Mar. 03, 2020
Applicants:

Tomomitsu Ohara, Tokyo, JP;

Kazuki Tsutsumi, Tokyo, JP;

Shinji Kimura, Tokyo, JP;

Syuhei Suzuki, Tokyo, JP;

Yusuke Ohba, Tokyo, JP;

Inventors:

Tomomitsu Ohara, Tokyo, JP;

Kazuki Tsutsumi, Tokyo, JP;

Shinji Kimura, Tokyo, JP;

Syuhei Suzuki, Tokyo, JP;

Yusuke Ohba, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/347 (2006.01); G01D 5/30 (2006.01);
U.S. Cl.
CPC ...
G01D 5/34746 (2013.01); G01D 5/30 (2013.01); G01D 5/34715 (2013.01);
Abstract

An optical module includes a fixed substrate, and a sensor substrate secured to the fixed substrate and having a through-hole formed therein. A light emitting device is secured to the fixed substrate at a position in the through-hole. A light receiving device is provided in the sensor substrate. A dummy light receiving device is formed between the light receiving device and the through-hole, around the through-hole, and in the sensor substrate. The light receiving device and the dummy light receiving device are made of an impurity diffusion layer having a same conductive type as a conductive type of a surface layer of the sensor substrate. The dummy light receiving device is deeper than the light receiving device.


Find Patent Forward Citations

Ohara, Tomomitsu. (2021). Optical module and optical encoder comprising a dummy light receiving device formed between a light receiving device and a through hole in a sensor substrate (U.S. Patent No. 11112279). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11112279

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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