The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Jan. 03, 2019
Applicant:

Bayerische Motoren Werke Aktiengesellschaft, Munich, DE;

Inventors:

Christian Haslauer, Freising, DE;

Peter Hirsch, Freising, DE;

Robert Kirschner, Olching, DE;

Bernhard Glueck, Fuerstenfeldbruck, DE;

Martin Becker, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16B 5/08 (2006.01); B21J 15/00 (2006.01); B23K 11/11 (2006.01); B23K 11/20 (2006.01); F16B 11/00 (2006.01); B23K 11/34 (2006.01); B21K 25/00 (2006.01); F16B 17/00 (2006.01);
U.S. Cl.
CPC ...
F16B 5/08 (2013.01); B21J 15/00 (2013.01); B21K 25/00 (2013.01); B23K 11/115 (2013.01); B23K 11/20 (2013.01); B23K 11/34 (2013.01); F16B 11/006 (2013.01); F16B 17/00 (2013.01);
Abstract

A method for undetachably introducing a guiding aid element into at least one joining location of at least one component is provided. The method includes the acts of: a) perforating the at least one component at the at least one joining location in a first press stroke of a tool press, wherein a preliminary hole is formed at the at least one joining location; b) inserting a joining aid element into the at least one preliminary hole; and c) pressing the at least one joining aid element with the at least one component in a subsequent press stroke or working step to form a material-bonding, form-fitting and/or force-fitting connection between the at least one component and the at least one joining aid element. A component and a composite component produced by such a method are also provided.


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