The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Mar. 25, 2019
Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Tesshu Murakawa, Tokyo, JP;

Hiroshi Fujimura, Tokyo, JP;

Satoshi Kano, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/42 (2006.01); C22C 38/34 (2006.01); C22C 38/06 (2006.01); C22C 38/04 (2006.01); C22C 38/00 (2006.01); C21D 9/46 (2006.01); C21D 8/12 (2006.01); C21D 8/00 (2006.01); C21D 6/00 (2006.01); H01F 1/147 (2006.01); B32B 15/01 (2006.01); C23C 30/00 (2006.01); C22C 38/40 (2006.01); C22C 38/02 (2006.01); C22C 38/08 (2006.01); C22C 38/16 (2006.01); C22C 38/18 (2006.01); C22C 38/20 (2006.01); C22C 38/38 (2006.01); C22C 38/58 (2006.01);
U.S. Cl.
CPC ...
C22C 38/42 (2013.01); B32B 15/01 (2013.01); C21D 6/004 (2013.01); C21D 6/005 (2013.01); C21D 6/008 (2013.01); C21D 8/005 (2013.01); C21D 8/1222 (2013.01); C21D 9/46 (2013.01); C22C 38/00 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/008 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/34 (2013.01); C22C 38/40 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H01F 1/147 (2013.01); C21D 8/12 (2013.01); C22C 38/004 (2013.01); C22C 38/02 (2013.01); C22C 38/08 (2013.01); C22C 38/16 (2013.01); C22C 38/18 (2013.01); C22C 38/20 (2013.01); C22C 38/38 (2013.01); C22C 38/58 (2013.01); C22C 2202/02 (2013.01); Y10T 428/12951 (2015.01); Y10T 428/12972 (2015.01);
Abstract

A non-oriented electrical steel sheet including, as a chemical composition, by mass %: C: 0.0030 % or less; Si: 2.00 % to 4.00 %; Al: 0.01 % to 3.00 %; Mn: 0.10 % to 2.00 %; P: 0.005 % to 0.200 %; S: 0.0030 % or less; Cu: more than 1.0 % and 3.0 % or less; Ni: 0.10 % to 3.0 %; one or more coarse precipitate forming element: more than 0.0005 % and 0.0100 % or less in total; a parameter Q (Q=[Si] +2 [Al] [Mn]) is 2.00 or more; Sn: 0.00 % to 0.40 %; Cr: 0.0 % to 10.0 %, and a remainder: Fe and impurities, wherein a number of Cu particles having a diameter of less than 100 nm is 5 or more per 10 μm, a {} crystal orientation intensity is 2.4 or more, a thickness is 0.10 mm to 0.60 mm, and an average grain size is 70 μm to 200 μm.


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