The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Sep. 15, 2016
Applicants:

Maxell Holdings, Ltd., Kyoto, JP;

Mimaki Engineering Co., Ltd., Nagano, JP;

Inventors:

Katsuyuki Kitou, Osaka, JP;

Taeko Izumo, Osaka, JP;

Masakatsu Okawa, Nagano, JP;

Kenta Hongo, Nagano, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); C09D 11/101 (2014.01); B33Y 70/00 (2020.01); B41M 5/00 (2006.01); B29C 67/00 (2017.01); B29C 64/112 (2017.01); B29C 64/40 (2017.01); C09D 11/107 (2014.01); C09D 11/30 (2014.01); C09D 11/322 (2014.01); B29K 33/00 (2006.01); B29K 71/00 (2006.01);
U.S. Cl.
CPC ...
C09D 11/101 (2013.01); B29C 64/112 (2017.08); B29C 64/40 (2017.08); B29C 67/00 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B41M 5/00 (2013.01); C09D 11/107 (2013.01); C09D 11/30 (2013.01); C09D 11/322 (2013.01); B29K 2033/08 (2013.01); B29K 2071/02 (2013.01); B29K 2071/12 (2013.01);
Abstract

There is provided a light curing molding ink set used for a manufacturing method for light curing molding using an ink-jet scheme, comprising a combination of a resin composition for a modeling material used for shaping the modeling material and a resin composition for a supporting material used for shaping the supporting material, wherein surface tension Mt (mN/m) of the resin composition for a modeling material is greater than surface tension St (mN/m) of the resin composition for a supporting material, and the surface tension Mt and the surface tension St satisfy the [0<Mt −St<5] expression, and this light curing molding ink set can afford a light cured article having the good dimensional accuracy.


Find Patent Forward Citations

Loading…